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We have very high capability for PCB manufacturing and PCB assembly service
PCB Capability
| Layers | 2 - 32 L. |
| Substrate | FR-4,,CTI600,Tg180,,Anti CAF,Halogen-free,Aluminum-substrate,Copper-strate,High frequency,Tg170&HF,Ceramic |
| Max. panel size | 630 mm x 1200 mm (Double layer),550 mm x 650 mm (Multilayer) |
| Board thickness | 0.2 mm - 6 mm. |
| Copper thickness | 4 oz. (inner) to 6 oz. (outer) (Max) |
| Hole | > 0.15mm. |
| Aspect Ratio | 13 : 1 (Advanced 14:1) |
| Min. track width | 2.5 mils(partial) 3mil |
| Min. track space | 2.5mils(partial) 3mil |
| Special process |
Via in PAD,Resin plugging,Depth routing,Half PTH hole,Blind &buried hole,Press-fit, Countersink drill |
| Min. S/M dam | 3mil |
| Hole plugging diameter | 0.3 mm-0.55 mm. |
| Impedance tolerance | +/- 10% |
| Color of S/M | green,white,black,red,orange,yellow,blue,purple |
| Surface treatment | OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable mask,Carbon ink print,Kapton tape,Selective OSP,Dual HAL&Gold finger,Dual ENIG&Golder finger |
PCB Assembly Service Capability
| Item | Lot Size | ||||
| Normal | Special | Remark | |||
| PCB(used for SMT)spec | (L*W) | Min | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥50mm | |||||
| Max | L≤460mm | L ＞ 460mm | |||
| W≤400mm | W＞ 400mm | ||||
| (Thickness) | Min thickness | 0.5mm | T＜0.5mm | ||
| Max thickness | 4.5mm | T＞4.5mm | |||
| SMT components spec. | dimension | Min size | 201 | 1005 | / |
| (0.6mm*0.3mm) | (0.3mm*0.2mm) | ||||
| Max size | 200mm*125mm | 200mm*125mm＜SMD | / | ||
| component thickness | T≤6.5mm | 6.5mm＜T≤15mm | / | ||
| QFP,SOP,SOJ(multipins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | / | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | / | |
| Item | Prototype Manufacturer | ||||
| Normal | Special | Remark | |||
| SMT PCB SPEC | (L*W) | Min size | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥30mm | |||||
| Max size | L≤450mm | L:800-450mm | |||
| W≤350mm | W:400-350mm | ||||
| (Thickness) | Minimum thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L＜50mm | |
| W≥30mm | |||||
| Max Size | L≤500mm | L≥500mm | |||
| W≤300mm | W≥300mm | ||||
| (Thickness) | Minimum Thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256
Fax: 86-755-61658416